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SPECIFICATION FOR LCM MODULE
MODULE NO.: HY-1602A-201-R DOC. REVISION 02
Customer Approval:
SIGNATURE PREPARED BY (RD ENGINEER) PREPARED BY (QA ENGINEER) CHECKED BY APPROVED BY
DATE Feb-18-2009
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DOCUMENT REVISION HISTORY
Version 00 01 02 DATE Jun-14-2005 Sep-07-2005 Feb-18-2009 DESCRIPTION First issue Change IC Character Change corporation LOGO Change SPEC format Modify temperature characteristic CHANGED BY
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CONTENTS
1. Functions & Features 2. Mechanical specifications 3. Block diagram 4. Dimensional Outline 5. Pin description 6. Maximum absolute limit 7. Electrical characteristics 8. Backlight specification 9. Electro-Optical characteristics 10. Control and display instruction 11. Font Characteristic 12. Precaution for using LCD/LCM 13. LCM test criteria 1 1 1 2 3 3 4-6 6 7 8 9 10-11 12-21
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1. FUNCTIONS & FEATURES
1.1. Format 1.2. LCD mode 1.3. Viewing direction 1.4. Driving scheme 1.5. Power supply voltage (VDD) 1.6. LCD driving voltage 1.7. Operation temp 1.8. Storage temp 1.9. Backlight color 1.10 RoHS standard : 16x2 characters : STN / Positive/Transflective/Y-G : 6 o'clock : 1/16 Duty , 1/5 Bias : 5.0V : 3.9V(reference voltage) : -20~70 : -30~80 : Bottom ,Yellow-Green
2. MECHANICAL SPECIFICATIONS
2.1. Module size 2.2. Viewing area 2.3. Character pitch 2.4. Character size 2.5. Dot pitch 2.6. Dot size 2.7. Weight : 80.0mm(L)*36.0mm(W)*13.1mm (H) max : 64.3mm(L)*13.7mm(W) : 3.65mm(L)*5.05mm(W) : 2.95mm(L)*4.35mm(W) : 0.60mm(L)*0.55mm(W) : 0.55mm(L)*0.50mm(W)
: Approx.
3. BLOCK DIAGRAM
CONTROL DATA
DRIVE LSI
SPLC100 SEG
VSS VDD Vo RS E R/W DB0-DB7
LEDA LEDK
CONTROL LSI
SPLC780D1-001
COM
LCD Panel LCD MODULE Backlight
VDD(+5.0V)
SEG
Vo VR(0~20K) VSS(0V)
110mA
(Refer Voltage:5.0V)
Figure 1. Block diagram
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4. DIMENSIONAL OUTLINE
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REV A00 A01 B
First issue Change IC Change LOGO
DESCRIPTION DATE FEB-23-2006 APR-05-2006 Feb-17-2009
Figure 2. Dimensional outline
PIN PIN 1 9 2 10 3 11 4 12 5 13
PART NO: PROJECTION
6 14
7 15
8 16
SCALE:
FIT
SHEET:
MODULE NUMBER
1
OF
GENERAL TOL: 0.3 APPROVALS
1
UNIT mm DATE
APP: CHK:
DO NOT SCALE THIS DRAWING.
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DWN:
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5. PIN DESCRIPTION
No. 1 2 3 4 5 6 7~14 15 16 Symbol VSS VDD V0 RS R/W E DB0~DB7 LEDA LEDK Function Power ground (0V) Power supply for Logic(+5V) Power supply for LCD drive Register selection (H: Data register , L :Instruction register) Read/write selection (H: Read , L: Write) Enable signal. Data Bus line Power supply for Backlight(Current 110mA,reference voltage +5.0V) Power supply for Backlight(0V)
6. MAXIMUM ABSOLUTE LIMIT
Item Supply Voltage for Logic Supply Voltage for LCD Input Voltage Supply Current for Backlight Reverse Voltage for Backlight Operating Temperature Storage Temperature Symbol VDD V0 Vin IF(Ta = 25C) VR(Ta = 25C) Top Tst MIN -0.3 VDD-10.0 -0.3 -----20 -30 MAX 7.0 VDD+0.3 VDD+0.3 145 10.0 70 80 Unit V V V mA V
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7. ELECTRICAL CHARACTERISTICS
7.1 DC characteristics (VDD=4.5V-5.5V,TA=25)
7.2 AC characteristics(VDD=4.5V-5.5V,TA=25) Write mode (writing data from MPU to SPLC780D1)
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Read mode (reading data from SPLC780D1 to MPU)
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Interface mode with LCD driver
8.BACKLIGHT CHARACTERISTICS
LCD Module with Bottom Yellow-Green LED Backlight ELECTRICAL RATINGS Ta = 25C
Unit Item Symbol Condition Min Typ Max Forward Voltage VF IF=110mA 4.0 4.2 4.4 V Reverse Current IR VR=10.0V --110 --uA Luminous Intensity Lv IF=110mA 125 170 --cd/m2 (Without LCD) Peak wave length IF=110mA 569 572 575 Color Yellow-Green Note: when the temperature exceed 25, the approved current decrease rate for Backlight change as the temperature increase is: -0.36x11mA/(below 25, the current refer to constant, which would not change with temperature ).
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9. ELECTRO-OPTICAL CHARACTERISTICS
( VDD=5.0V, Ta = 25C ) Item Operating Voltage Response time Contrast Viewing angle range Symbol Vop Tr Tf Cr Condition Ta = -20C Ta = 25C Ta = 70C Ta = 25C Ta = 25C Cr2 Min 4.1 3.5 3.4 -------40 -40 Typ 4.4 3.8 3.6 185 200 4 ----Max 4.7 4.0 3.8 ------+40 +40 Unit V ms ms --deg deg
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10. CONTROL AND DISPLAY INSTRUCTION
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11. FONT CHARACTERISTIC
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12. PRECAUTION FOR USING LCD/LCM
After reliability test, recovery time should be 24 hours minimum. Moreover, functions, performance and appearance shall be free from remarkable deterioration within 50,000 hours average under ordinary operating and storage conditions room temperature (20+8C), normal humidity (below 65% RH), and in the area not exposed to direct sun light. Using LCM beyond these conditions will shorten the life time. Precaution for using LCD/LCM LCD/LCM is assembled and adjusted with a high degree of precision. Do not attempt to make any alteration or modification. The followings should be noted. General Precautions: 1. LCD panel is made of glass. Avoid excessive mechanical shock or applying strong pressure onto the surface of display area. 2. The polarizer used on the display surface is easily scratched and damaged. Extreme care should be taken when handling. To clean dust or dirt off the display surface, wipe gently with cotton, or other soft material soaked with isoproply alcohol, ethyl alcohol or trichlorotriflorothane, do not use water, ketone or aromatics and never scrub hard. 3. Do not tamper in any way with the tabs on the metal frame. 4. Do not make any modification on the PCB without consulting AV. 5. When mounting a LCM, make sure that the PCB is not under any stress such as bending or twisting. Elastomer contacts are very delicate and missing pixels could result from slight dislocation of any of the elements. 6. Avoid pressing on the metal bezel, otherwise the elastomer connector could be deformed and lose contact, resulting in missing pixels and also cause rainbow on the display. 7. Be careful not to touch or swallow liquid crystal that might leak from a damaged cell. Any liquid crystal adheres to skin or clothes, wash it off immediately with soap and water.
Static Electricity Precautions: 1. CMOS-LSI is used for the module circuit; therefore operators should be grounded whenever he/she comes into contact with the module. 2. Do not touch any of the conductive parts such as the LSI pads; the copper leads on the PCB and the interface terminals with any parts of the human body. 3. Do not touch the connection terminals of the display with bare hand; it will cause disconnection or defective insulation of terminals. 4. The modules should be kept in anti-static bags or other containers resistant to static for storage.
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5. Only properly grounded soldering irons should be used. 6. If an electric screwdriver is used, it should be grounded and shielded to prevent sparks. 7. The normal static prevention measures should be observed for work clothes and working benches. 8. Since dry air is inductive to static, a relative humidity of 50-60% is recommended. Soldering Precautions: 1. Soldering should be performed only on the I/O terminals. 2. Use soldering irons with proper grounding and no leakage. 3. Soldering temperature: 280C+10C 4. Soldering time: 3 to 4 second. 5. Use eutectic solder with resin flux filling. 6. If flux is used, the LCD surface should be protected to avoid spattering flux. 7. Flux residue should be removed. Operation Precautions: 1. The viewing angle can be adjusted by varying the LCD driving voltage Vo. 2. Since applied DC voltage causes electro-chemical reactions, which deteriorate the display, the applied pulse waveform should be a symmetric waveform such that no DC component remains. Be sure to use the specified operating voltage. 3. Driving voltage should be kept within specified range; excess voltage will shorten display life. 4. Response time increases with decrease in temperature. 5. Display color may be affected at temperatures above its operational range. 6. Keep the temperature within the specified range usage and storage. Excessive temperature and humidity could cause polarization degradation, polarizer peel-off or generate bubbles. 7. For long-term storage over 40C is required, the relative humidity should be kept below 60%, and avoid direct sunlight. Limited Warranty AV LCDs and modules are not consumer products, but may be incorporated by AV's customers into consumer products or components thereof, AV does not warrant that its LCDs and components are fit for any such particular purpose. 1. The liability of AV is limited to repair or replacement on the terms set forth below. AV will not be responsible for any subsequent or consequential events or injury or damage to any personnel or user including third party personnel and/or user. Unless otherwise agreed in writing between AV and the customer, AV will only replace or repair any of its LCD which is found defective electrically or visually when inspected in accordance with AV general LCD inspection standard . (Copies available on request) 2. No warranty can be granted if any of the precautions state in handling liquid crystal display above has been disregarded. Broken glass, scratches on polarizer mechanical damages as well as defects that are caused accelerated environment tests are excluded from warranty. 3. In returning the LCD/LCM, they must be properly packaged; there should be detailed description of the failures or defect.
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13. LCM test criteria
1Objective
The criteria is applied for consolidating the LCM quality standard between AVD and customer in finished products acceptance inspection and shipment, to guarantee the products quality to meet with customer's demand.
2Scope
2.1 This criteria is applicable to all the LCM products produced by AVD.
3Inspection equipment
Function TesterVernier CalipersMicroscopeMagnifierESD Wrist StrapFinger CoverLabels High-Low Temperature Oven RefrigeratorConstant Voltage Power SupplyDCDesk Lamp, etc.
4Sampling Plan and Reference Standard
4.1.1 According to GB/T 2828.1---2003/ISO2859-1:1999single sampling under normal inspection, general inspection level II. Item of Inspection Cosmetic
Mechanical Functional
Times of Sampling II Single Sampling N=3
AQL Judgment MA=0.4 MI=1.5 C=0
4.1.2 4.1.3 4.1.4 4.1.5 4.1.6
II Single Sampling MA=0.4 MI=1.5 GB/T 2828.1---2003/ISO2859-1:1999 Counting and sampling procedures and sampling table for Batch-to-Batch Inspection. GB/T 1619.96 Test method for TN LCD. GB/T 12848.91 General Specification for STN LCD. GB2421-89 Basic Environmental Test Procedures for Electrical and Electronic Products IPC-A-610C Acceptance Condition for Electrical Assemblies.
5Inspection Condition and Inspection Reference
5.1 The ambient temperature and humidity are 255 and 4520%RH respectively, and the ambient luminance should be more than 300cd/cm2. The distance between inspector's eyes and the LCD panel should be 30cm away. Normally we inspect products with reflected light, when we inspect the LCD produces with backlight turned on, the ambient luminance should be less than 100cd/cm2. 5.2 The LCD should be test with 45both left and right side, 0-45both upside
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and downside if for STN product, -20-55is needed.
45 45
5.3 Definition of VA VAeffective viewing area
Non-VAIneffective viewing area 5.4 Inspection with viewed eyesnot including defect size measure by magnifiers. 5.5 Electrical property Inspect with the test jig to meet with the requirement indicated in the approved documents, including the pattern design and the display performance. 5.5.1 Testing voltageV 5.5.1.1 According to the inspection of test jig and production specification the test voltage setting is Vop0.3V when the Vop is under 9.0V, and Vop 3%Vop when the Vop is above 9.0V. 5.5.1.2 As per the product with the fixed voltage the test voltage setting is same as Vop and keeps the constant voltage through the internal circuit. And the limited sample on the voltage range is needed if necessary. 5.5.2 Current ConsumptionIrefer to product document and approval drawing to confirm it.
6Inspection Item and Acceptance Standard
6.1 Outer dimensionFor the outer dimension and the sizes which could influence the assembly at the customer's side, it should be in accordance to the approval drawing, and it belongs to the major defect. 6.2 Functional Test:
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No.
Item
Description Any missing segment caused by an open circuit; Any missing COM, pattern, dot or segment caused by an open circuit or poor crossover contact
MAJ
MIN
Accept standard
6.2.1
Missing Segment
Rejected
6.2.3 6.2.4
6.2.5
No segment is displayed when the product is connected correctly. The display pattern and display order is Display not as required under the normal scanning error/abnormal procedure. The direction with the best display of Viewing angle patterns should be as customer required wrong (or refer to the approval samples) Display dim/dark The contrast of LCD is too dark or too dim under normal operation
No display/no action

Rejected Rejected
Rejected Beyond the voltage tolerance, Rejected Rejected refer to spot/line standard Reject or refer to samples refer to the spot/line criteria for the visible spots when display image stopped, others O refer to spot/line standard
6.2.6
6.2.7
6.2.8
Response of some segments is different Slow response with others when turned on or off the LCD Display of wiring, or extra pattern, caused Extra segment by wrong alignment or insufficient corrosion.. Dim segment Under the normal voltage, the contrast of segment are uneven
6.2.9
6.2.10
Partial black and white spot are visible PI black/white while changing display content due to the spot PI layer defective
6.2.11
pinhole/white spot
The phenomena of missing patterns when turned on caused by missing of ITO fragment.
Y X
d = (X+Y)/2
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6.2.12
Pattern distortion
Width of pattern displayed is wider , narrower or deformed from the specifications caused by wrong alignment, i.e. extra heave or missing: |Ia-Ib| 1/4W(W is the normal width)
Acceptable |Ia-Ib|>1/4W, rejected
6.2.13
High current
the current is bigger than regulated value.
Rejected
6.3 LCD Visual Defect 6.3.1 Dot defect(defined within VA, out of VA spots not accounted) Average diameter Defect item Accept numbers d Spot defect 3 d0.2 black spot, foreign 2 0.2MAJ
MIN
MAJ
MIN
note 1. If the width is bigger than 0.1mm, it can be treated as spot defect. 6.3.3 Polarizer Air Bubble (defined within VA, out of VA spots not accounted) Average diameter Defective item Accept numbers MAJ MIN d polarizer Air Bubble 3 d0.3 Concave-Convex Dot 2 0.315
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Chip on lead
X Y
1/8L 1/3W
chip on corner(ITO lead)
Z 1/2t Accept 2 number When Y0.2mm, neglect the length of X, chip on the side without lead, and not perforated, when X1/10L Y1/2W max, accept. mm MAJ MIN Not enter into X frame epoxy and touch the Y lead Z t
6.3.4.2
Chip on sealed area (outer chip)
Accept 2 numbers Chips on corner refer to 6.3.4.3 and must be out of the frame epoxy. If chips on lead, refer to 6.3.4.1 mm MAJ MIN X Y 1/8 L 1/2H
z 1/2t Accept 2 numbers The standard for inner chip on sealed area is same as the standard for outer. If chip on the opposite side of ITO lead, the value Y refer to 6.3.4.1 for the chip on the side without lead. note: t---glass thickness, L---length, H---The distance between the LCD edge to the inner of LCD frame epoxy. W--The width of ITO lead 6.3.5 Others Accept No. Item Description MAJ MIN standard Newton/ Reject or refer There exists more than one color on one B/G color 6.3.5.1 to limited uniformity product or same batch. sample not good 6.3.5.2 Leakage(LC) / Rejected No protective 6.3.5.3 / Rejected film 6.3.4.3
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6.4 No. 6.4.1
Backlight components Item Backlight not work, wrong color Color deviation Description / Turn backlight, the color differ from the sample, do not match the drawing after testing Turn on backlight, the brightness is differ from the sample, or do not match the drawing after testing, or over30% compare with sample if drawing not specified. Turn on the backlight, the brightness is uneven on the same LED and beyond the specification of drawing. There is stain, scratches on backlight when turn on. Description Mental frame/surface approach inconsistent with specification. Twist method/direction wrong, not twist as required MAJ MAJ MIN Accept standard Rejected Refer to sample and drawing Refer to sample and drawing Refer to sample and drawing Refer to 6.3.1/6.3.2 Accept standard Rejected Rejected
6.4.2
6.4.3
Brightness deviation
6.4.4 6.4.5 6.5 No. 6.5.1 6.5.2
Uneven brightness Spot/line scratch Mental frame Item

MIN
material/surface Twist not qualified/without twisting
6.5.3
6.5.4 6.6 No. 6.6.1
1.Oxidized steak on the surface of the metal frame;2. front surface paint scratch to substrate, the stripped spot Oxidized steak, paint 0.8mm and exceed 3 areas;3.line defect in length5.0mm and width stripped, color changed, dented 0.05mm exceed 2 areas, front dent, mark, scratches bubble and side surface have paint stripping to substrate1.0mm exceed 3 areas, line defect in width 0.05mm exceed 3 areas. Burr is too long, enter into viewing Burred area PCB/COB Item Epoxy Cover Description 1. The Pad within the round white mark is exposed to outside. MAJ
Rejected
Rejected Accept standard Rejected
MIN
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6.6.2
6.6.3
6.7 No. 6.7.1 6.7.2
2. The height of epoxy covers beyond document /drawing specification. 3. The epoxy should be covered within the white round mark and the maximum overage is 2mm more than the radius of white mark. 4. Clear liner mark on COB surface or pinhole that it is possible to penetrate through the epoxy to chip. 5. The pinhole diameter over 0.25mm or other material on COB surface. 1. PCB pad surface can not be oxidized or contaminated. 2. PCB can not appear bubbles after through the reflow oven. 3. Copper lead due to the PCB green oil PCB drop or scratches. cosmetic If repaired by adding the green oil, defect circuit diameter can not over 1.3mm, other diameter can not over 2.6mm, total less than 10 areas. Otherwise reject. 1. PCB components inconsistent with drawing. Wrong components, more or less pa, polar reverseThe bias circuit of LCD voltage or BL limit current value adjustment is not controlled if not special specified. Components 2. The JUMP short of PCB should be error consistent of the mechanical drawing. 3. The components is specially required by the customers and specified in mechanical drawing / technical documents, the components specification should be conformed to technique demand. Otherwise rejected SMT part (Refer to IPC-A-610C if not specified) Item Soldering defect Solder ball/splash Description Cold soldering, false solder, missing solder, tin crack, tin un-dissolved happened with soldering. Solder ball/tin dross drop lead to solder short.
Improper
Rejected
Rejected
MAJ
MIN
Accept standard Rejected Rejected
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6.7.3 6.7.4
DIP parts Spot weld shape
DIP parts, keypad, connection appear floating and tilted.

Rejected Rejected
6.7.5
6.7.6 6.8 No. 6.8.1
The spot weld should be inner dent, can not form to cover solder or less solder or icicle, otherwise reject For the DIP type components, after Component soldered, 0.5~2mm component foot must be remained, and should not damage the solder foot exposed surface nor fully covered the component foot. Otherwise rejected. After soldering, the solder residues appear Appearance brown or black. PCB solder spot remained poor white mist residues after clean. Heating pressure part (including H/SFPC, etc. Item Out of specif ication The size of heating material should be within the specification of the drawing, the Size/position contact area of conducted material should be attached more than 1/2 of the body (ITO, PDA, etc) The obstacle existed in non-conductive Heat heating area and not lead to short, or existed pressure in conductive area but the obstacle is less dirty than 50% of pressure area, it is acceptable. Folding defect Connector and other parts Item Description MAJ Description MAJ
Rejected
Rejected
MIN
Accept standard Rejected
6.8.2
Acceptable
6.8.3
Acceptable Refer to limited sample Accept standard Rejected
6.8.4 6.9 No. 6.9.1 6.9.2
MIN
6.9.3
The specification of connector and other Specification components do not conform to the drawing improper as required. Position and Solder position and Pin 1 should be order consistent with the drawing. 1. The body of outer component and the PIN has flux. Cosmetic 2. The deformation bigger of PIN connector is bigger than 1/2 of PIN width.
Rejected
Rejected
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6.10 No.
General cosmetic Item Description MAJ MIN Accept standard
6.10.1
6.10.2
6.10.3
6.10.4 6.10.5
6.10.6
Copper lead on FPC pad or the pin terminal of H/S, FFC and damaged. FPC,FFC, COF,H/S connected material Connection curved except for original . material FPCPCB pad is bigger than 1PIN width. FPC/FFC material segment, crease exceed the specification. Stiffening tape is not covered or fully Stiffing type covered the product's circuit needs to be defect protected. Like H/SFFCFPC or cover to the output pin. Dirty on surface of finished products, residual glue, solder spatter or solder ball remain on non-soldered area of Visual dirty PCB/COB. The defective mark or label on product does not remove. Assembly The spot or black dots found after assembly black spot the products with backlight or diffuser. Part number and batch mark is not Product conformed with the technical requirement mark and position, not clear or without mark. Packing is inconsistent with requirement Inner short or over loadPacking is inconsistent packing with shipment mark/ order demand.
Rejected
Rejected
Rejected

Refer to 6.3.1 Rejected
Rejected
7Reality test
Test item High Temp Storage High Temp Operating Low Temp Storage Low Temp Operating Temp& Humidity Test Temp Shock Condition 80C 70C -30C -20C 40C/90%RH -20C 25C +70C (30 min 5 min 30min) 10 cycles Time(hrs) 120 120 120 120 120 No abnormalities in functions and appearance Accept standard
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Note: The customer should inform the special requirements on the reliability test to AVD when starting the project. For high/low temperature test under both storage and operating condition, the temperature is referrer to the product specification. For temperature test 5 deviation could be accepted.
8Packing
8.1 Product packing must meet the requirement of packing design. The label should be qualified by QA department and it includes the Item No., specification sheet, quantity and production date. Incomplete or mistake is regarded as not qualified. 8.2 When the safety of the packing exist the problems, including shock resistance, moisture resistance, anti-ESD and press resistance, it is regarded as not qualified. 8.3 When customer has special requirement on packing, which is confirmed and accepted by AVD, inspect and release the products as customer required. 8.4 For RoHS or non-RoHS products it should be distinguished with obvious label. Currently we adopt the "RoHS" label for all the products meet the RoHS compliance, or using the labels / marks as the customer required.
9Others
9.1 For unregulated and compromised items, reference shall be taken to mutual agreements and limit samples.
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